Extreme 10945
| Part Number | 10945 |
| Product Name | Summit Fan module FB |
| Product Description | Fan Module for Summit X460-G2/X450-G2 Series Switches - front to back airflow |
| Product Note | |
| List Price | 419.00 |
| Service Suffix | |
| Service Association | 16701, 16702, 16703, 16704, 16705, 16706, 16716, 16717, 16718, 16719, 16172?, 16173?, 16174?, 16175?, 16176?, 16177?, 16178?, 16 |
| Service Class | |
| Product Warranty for new product purchases only https://www.extremenetworks.com/support/policies | Ltd. Lifetime Warranty with express Advanced Hardware Replacement |
| EOS Announce | |
| EOS Date | |
| End-of-Support | |
| Product Family | Summit |
| Product title | Extreme Network Summit X460-G2 Fan Module - Fan unit (front-to-back) - for ExtremeSwitching X460-G2 Series (10945) |
| Identification serial | 10945 |
| Unspsc | None |
| Image filename | No Picture |
| Product overview | The Summit X460-G2 series is based on extreme networks revolutionary ExtremeXOS, a highly resilient OS that provides continuous uptime, manageability and operational efficiency. Each switch offers the same high-performance, non-blocking hardware technology, in the extreme networks tradition of simplifying network deployments through the use of common hardware and software throughout the network.The Summit X460-G2 switches are effective campus edge switches that support Energy Efficient Ethernet (EEE - IEEE 802.3az) with IEEE 802.3at PoE-plus and can also serve as aggregation switches for traditional enterprise networks. TheSummit X460-G2 series is also an option for DSLAM or CMTS aggregation, or for active Ethernet access.The Summit X460-G2 can also be used as a top-of-rack switch for many data center environments with features such as high-density Gigabit Ethernet for concentrated data center environments; XNV (ExtremeXOS Network Virtualization) for centralized network-based Virtual Machine (VM) inventory, VMlocation history and VM provisioning; direct attach to offload VM switching from servers, thereby improving performance; high-capacity layer 2/layer 3 scalability for highly virtualized data centers; and intra-rack and cross-rack stacking withindustry-leading flexibility. |
| Tech params | None |